aWashington University Pain Center and
bDepartment of Anesthesiology, Washington University School of Medicine, St. Louis, MO, USA, Washington University School of Medicine, St. Louis, MO, USA
cDepartment of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA. Kim is now with the Department of Electronics Convergence Engineering, Kwangwoon University, Seoul, Republic of Korea
dDepartment of Chemical and Biological Engineering, KU-KIST Graduate School of Converging Science and Technology, Korea University, Seoul, Republic of Korea
eDepartments of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL, USA
fAML, Department of Engineering Mechanics, Center for Mechanics and Materials, Tsien Excellent Education Program, School of Aerospace, Tsinghua University, Beijing, China
gSchool of Aeronautic Science and Engineering, Institute of Solid Mechanics, Beihang University (BUAA), Beijing, China
hDepartments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, and Neurological Surgery, Center for Bio-Integrated Electronics, Simpson Querrey Institute for Nano/biotechnology, Northwestern University, Evanston, IL, USA
*Corresponding author. Address: Department of Anesthesiology, Washington University School of Medicine, 660 S Euclid Ave, Campus Box 8054, St. Louis, MO, 63110, USA. E-mail address: [email protected] (R. W. Gereau).
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